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SCA-1000
WS-1000
Feature
Alignment accuracy achieves submicron (within ±0.2μm) of high precision with IR image processing.
Fast response ceramic heater.
For Chip level bonding (CoC) of LED, MEMS.
Selectable bonding methods
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Appearance
Size W980×D900×H1800mm
Weight 450kg
Utility
Air Pressure Dry Air 0.5MPa
Vacuum of Adsorption 100Pa
Power supply Three-phase AC 200V 50A
* Please contact for other specifications.
ProductLine upSCA-1000WI-1000WI-1000SCW-1000WAP-100WS-1000お問い合わせ

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