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Bonding kit for R&D with plasma treatment and bonder unit, and moderate price. |
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Achievement of bonding with heat-up pressing on 1ton. |
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Sheathed pressure resistance heaters are heating from upper and bottom side at same time. Under low temperature, it makes most appropriate anodic bonding condition. |
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Available to add RF radical treatment room to RIE plasma chamber. And possible to be room-temperature bonding from Sequential Process(O2/RF Plasma ⇒N2/Radical treatment). |
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With added on Anodic Power Supply. Achievement of Void-less depending on Surface Modification and Electrostatic Force under the “Hybrid-boding (O2Plasma⇒Superimposed Voltage). Low current flow reduces out gas. |
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