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WI-1000
WI-1000
Feature
The alignment technology by 6-axial piezo alignment system and MagicVision has accomplished the alignment precision of ±0.2µm or less after bonding in the vacuum chamber.
It can be used as surface activation bonder, nanoimprint device by combining the options.
The docking with plasma chamber enables the establishment of full-automation environment that supports the mass production of cassette to cassette.
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Appearance
Size W1000xD1000xH1800mm
Weight 900kg
Utility
Power supply Three-phase AC 200V 50A
Air Pressure Dry Air 0.5MPa
Gas Purge Nitrogen Dry Air Clean Air 0.5MPa
※Please inquire about some other specifications and details.
ProductLine upSCA-1000WI-1000WI-1000SCW-1000WAP-100WS-1000お問い合わせ

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