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Interlocked plasma unit and bonding unit by handling robot.This machine is full automation system of “cassette to cassette”. |
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Achieved minute movement for specific piezo actuator.5axis piezo alignment system and IR image processing achieved submicron bonding. |
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Surface Activation by Ar plasma bombardment.For Au-Au sealing, metallic bonding. |
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Capable to add RF radical treatment room to RIE plasma chamber.And possible to be room-temperature bonding from Sequential Process(O2/RF Plasma → N2/Radical treatment). |
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With added on Anodic PowerSupply.
Achievement of Voidless depending on Surface Modification and Electrostatic Force under the “Hybrid-bonding (O2Plasma → Superimposed Voltage.)“. |
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