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SCW-1000
SCW-1000
Feature
Alignment accuracy achieves submicron (within 0.2μm) of high precision. And also fine alignment coupled with IR image processing.
Fast response ceramic heater.
For Chip level bonding (COC) of MEMS, and also COW of wafer bonding.
Up to 300mm wafers. (at full auto)
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Appearance
Size W1200×D970×H2000mm
Weight 1200kg
Utility
Air Pressure Dry Air 0.5MPa
Vacuum of Adsorption -80kPa
Power supply Two-phase AC 200V 50A
※Please contact for other specifications.
ProductLine upSCA-1000WI-1000WI-1000SCW-1000WAP-100WS-1000お問い合わせ

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